Advantages of HDI PCB Technology

Advantages of HDI PCB Technology

The type and amount of vias, through-holes or microvias used on an HDI pcb will impact the price. It is also a factor when considering routing efficiencies.

To fabricate an HDI PCB, manufacturers use a series of sequential lamination processes to fuse copper and pre-preg layers together. These liquified laminates then cool and stick to each other.

Miniaturization of Hardware

Due to advances in IC manufacturing and PCB design, HDI technology is enabling sleek and compact electronics. From computers to smartwatches, you can now get advanced functionality and performance in a small form factor that fits comfortably in your hand. With further miniaturization of hdi pcb IC chips on the horizon, HDI PCBs will be able to handle even more complex and powerful functions.

In order to achieve this, high-density interconnect (HDI) requires different fabrication techniques and rules. The first step is determining the layer count required to route all of your signal paths. You can do this by calculating the ball pitch of your BGA components or using an interface + direction count from the largest IC on your circuit board. Next, you must determine the via size needed to connect each layer. Using filled plated microvias is an excellent way to increase the density of your design. These can be placed anywhere on the board and are a metallurgical bond between two adjacent layers.

Another important feature of HDI is the ability to reduce impedance and electromagnetic emissions. The shorter distances between components and the optimized routing path help to prevent signal loss, crosstalk, and noise interference. This can improve the reliability of your device and decrease the chances of potential failures. Besides enhancing signal integrity, HDI also helps in keeping costs down by decreasing the number of components and reducing the overall size of your device.

Enhanced Reliability

The smaller aspect ratios of HDI PCBs can enhance the reliability of the components used in them. This can reduce the number of failures in the final product, which can cut costs and save time. They also offer better mechanical performance than traditional PCBs. The smaller pads and spaces are easier to solder and can help reduce the risk of damage from mechanical shocks. This can make the products more attractive to consumers.

The small traces and vias on hdi pcbs can also improve signal integrity and EMI. This requires more careful design from the part designer, but can result in a significant reduction in signal loss and crossing delays. This can be beneficial for medical devices that need to have a lower inductance, such as pacemakers and other types of implantable devices.

Another advantage of HDI technology is that it can be fabricated in fewer layers than traditional multi-layer circuit boards. The laser-drilled holes are smaller, which reduces the cost of the board. This is particularly important for high-performance devices that require a lot of functionality but are constrained by space.

Some devices that use HDI PCBs include mobile/cellular phones, touch-screen devices, laptop computers, digital cameras, 4/5G network communications, and military applications such as satellites and avionics. These products are typically designed with multiple layers and feature a mix of blind and buried vias, as well as microvias.


Besides being able to accommodate more components, HDI PCBs are also less expensive than traditional PCBs. This is due to their smaller thickness, which saves on manufacturing costs. Additionally, they require less copper, which reduces the cost of raw materials. They are also much lighter, which can help reduce shipping and assembly costs. Lastly, they offer improved performance and reliability compared to standard PCBs.

A major advantage of using HDI PCBs is that they allow you to use shorter trace widths for signal propagation. However, it is important to design the board correctly in order to obtain optimum signal integrity. This includes utilizing the shortest lengths of traces, sufficient digital and ground planes, consistent impedances throughout the circuit, and power and analog signal isolation.

In addition to reducing the size and weight of devices, HDI PCBs can also be used to increase the routing density. To do this, designers must create a complex stack-up, which requires several sequences of lamination. For example, to achieve a 4+4+2 stack-up, you would need to fabricate eight layers. This increases the production time and costs.

To reduce these costs, you can use a via-in-pad process, which allows you to place vias on the surface of flat lands. This is a 10- to 12-step process that involves plating the via, filling it with one of the various via fill types, and capping it. This process can reduce the amount of copper needed, simplify thermal management, and reduce space requirements.


High-density PCBs can be used in a wide range of applications. For example, they are useful in medical devices because they can accommodate small hardware packages and still allow for fast transmission rates. In addition, they can reduce the number of wiring connectors, which helps lower cost and weight. They can also improve device reliability by reducing thermal stress.

The flexibility of hdi pcbs allows them to be bent, rolled or folded to fit the product. They are also lightweight and thin, which makes them easy to ship. Moreover, they can be positioned in spaces where conventional PCBs cannot work efficiently or at all.

Another benefit of hdi pcbs is that they can be made with finer pitch features than HDI PCB Supplier traditional circuit boards. This allows manufacturers to place more components on the board, which increases the circuit density and decreases the overall size of the device. This is particularly important in the automotive industry, where space limitations are an issue.

When designing HDI circuit boards, it is important to consider the routing widths and locations of each drilled hole. This will impact the design, but it is also important to think about the placement of ICs and other complex components, as this will affect the stack-up. When choosing the right stack-up, you should use a layering strategy that provides the best balance between performance and manufacturing time and cost. Ideally, the stack-up should not contain more than three sequential layers.